- step-on-wafer
- послідовне крокове експонування
English-Ukrainian dictionary of microelectronics. 2013.
step-on-wafer
Смотреть что такое "step-on-wafer" в других словарях:
direct step-on-wafer exposure — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… … Wikipedia
Wafer fabrication — is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Wafer… … Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
direkte Waferbelichtung im Step-and-Repeat-Verfahren — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
Non-contact wafer testing — Wafer testing is a normal step in semiconductor device fabrication, used to detect defects in integrated circuits (IC) before they are assembled during the IC packaging step. Traditional (contact) wafer testing Probing ICs while they are still on … Wikipedia
Die preparation — Wafer glued on blue tape and cut into pieces Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer… … Wikipedia
exposition successive directe — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
tiesioginis žingsninis plokštelės eksponavimas — statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на пластине, n pranc. exposition successive… … Radioelektronikos terminų žodynas
прямое последовательное шаговое экспонирование на пластине — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
DSW — Developer Studio Workspace (Medical) * Data Status Word (Computing » Assembly) * Dienst Sociale Werkvoorziening (Business » Firms) * Direct Step on Wafer (Academic & Science » Electronics) * Southwestern Bell Telephone Company (Business » NYSE… … Abbreviations dictionary
